I just did a pair of hammered rings with a nugget each, to match the circular nugget pendant in my albums and your technique worked a treat thanks - much more controllable solder this way. I did one that way yesterday by accident - in that the solder flowed but the nugget jumped out of position and didn't adhere properly, so I broke it apart and sanded the surfaces and re-fluxed and heated, hence asking about the soundness of putting solder between the surfaces and if paste was suitable for this sort of application.
I did it deliberately this time and when I came to join them I fluxed both surfaces and applied a little modest heat until the flux went gummy and stuck the pieces together enough to move them and removed the heat. I flipped them over so that the ring was on top of the nugget and the other side resting on a tuppence (I saw someone else make that suggestion here, so thanks) to keep it level and I could then apply the heat from the ring side which is much thinner and the solder flowed without risk of melting the thinner of the surfaces.
Worked a treat, nice neat join and no solder over the outer surface of the nugget.
Many thanks for sharing your knowledge, it's appreciated.
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